
Package designer
- 江苏省苏州市
- 长期
- 全职
- Power Package design considering design rule and advanced design rule
- Technical leading design related job locally and externally out of China
- Designer who is expert level on 2D & 3D modeling, Knowledgeable on Geometric Dimensioning and Tolerancing, knowledge on Semiconductor Assembly Processes and Design Rules (Sawing, DA/SMT, Al/Au WB, Molding, Plating, TnF, FT, Packing), knowledge on Wafer Fab processing and understanding of Die mask & vertical structures of MOSFET/IGBT/DIODES/ IC's, Knowledge on Wire Bonding diagram generation., Perform Assembly Design Rule Check for all New Products Dev't., * Knowledgeable on Jedec & EIAJ Packaging Standard, Knowledge on Magazine, Plastic Tubes, and other Jig & Fixture
- Education: Minimum 3yrs Diploma graduated
- Specialized knowledge: Semiconductor background work experience.
- Skills: AutoCAD, Solidworks, Communication skills, with written English and speaking.
- Other characteristics such as personal characteristics: Self-motivated, independent, open mind to communicate, be willing to take risk